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JEDEC JESD22-B117B PDF
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SOLDER BALL SHEAR
| Published by | Publication Date | Number of Pages |
| JEDEC | 05/01/2014 | 22 |
JEDEC JESD22-B117B – SOLDER BALL SHEAR
The purpose of this test is conducted to assess the ability of solder balls to withstand mechanical shear forces that may be applied during device manufacturing, handling, test, shipment and end-use conditions. Solder ball shear is a destructive test.
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