JEDEC JESD22-B116B PDF
JEDEC JESD22-B116B PDF
$40.70

JEDEC JESD22-B116B PDF

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WIRE BOND SHEAR TEST

Published byPublication DateNumber of Pages
JEDEC04/01/201732
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JEDEC JESD22-B116B – WIRE BOND SHEAR TEST

This test provides a means for determining the strength of a gold ball bond to a die bonding surface or an aluminum wedge or stitch bond to a die or package bonding surface, and may be performed on pre-encapsulation or post-encapsulation parts.The wire bond shear test is destructive.It is appropriate for use in process development, process control and/or quality assurance.

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