JEDEC J-STD-033D PDF

JEDEC J-STD-033D – Handling, Packing, Shipping, and Use of Moisture/Reflow Sensitive Surface-Mount Devices

The purpose of this document is to provide manufacturers and users with standardized methods for handling, packing, shipping, and use of moisture/reflow and process sensitive devices that have been classified to the levels defined in J-STD-020 or J-STD-075. These methods are provided to avoid damage from moisture absorption and exposure to solder reflow temperatures that can result in yield and reliability degradation. By using these procedures, safe anddamage-free reflow can be achieved. The dry-packing process defined herein provides a minimum shelf life of 12 months from the seal date.