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IPC SMC-TR-001 PDF
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An Introduction to Tape Automated Bonding Fine Pitch Technology
| Published by | Publication Date | Number of Pages |
| IPC | 01/01/1989 | 54 |
IPC SMC-TR-001 – An Introduction to Tape Automated Bonding Fine Pitch Technology
This document, co-developed by the IPC, EIA and ASTM, represents a comprehensive report on fine pitch technology with an emphasis on tape-automated bonding and design rules. Subjects include land pattern design, types of encapsulation, TAB tape format, assembly techniques and the advantages and disadvantages of FPT.
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