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IPC DD-135 PDF
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Qualification for Deposited Organic Interlayer Dielectric Materials for Multichip Modules
| Published by | Publication Date | Number of Pages |
| IPC | 08/01/1995 | 36 |
IPC DD-135 – Qualification for Deposited Organic Interlayer Dielectric Materials for Multichip Modules
This standard has been written for deposited organic interlayer dielectric materials under evaluation for MCM-D applications. The standard and test methods have been written without bias towards any particular class of materials.
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