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IPC 9504 PDF
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Assembly Process Simulation for Evaluation of Non-IC Components (Preconditioning Non-IC Components)
| Published by | Publication Date | Number of Pages |
| IPC | 06/01/1998 | 27 |
IPC 9504 – Assembly Process Simulation for Evaluation of Non-IC Components (Preconditioning Non-IC Components)
This document is another in a series and specifically addresses preconditioning of non-IC components used in electronic assembly. Do the components work with your process? That determination is the goal of these manufacturing process simulations; to ensure that the components chosen meet expected reliability requirements after exposure to factory processes. Developed for users and manufacturers, the procedure consists of a set of simulations, for non-IC component storage and use, wave and reflow soldering (SMT and PTH parts), exposure to corrosive (water soluble) fluxes, and exposure to often-used cleaning materials.
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