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IPC 9301 PDF
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Numerical Analysis Guidelines for Microelectronics Packaging Design and Reliability
| Published by | Publication Date | Number of Pages |
| IPC | 12/01/2018 | 92 |
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IPC 9301 – Numerical Analysis Guidelines for Microelectronics Packaging Design and Reliability
The IPC/JEDEC-9301document is an effort to standardize and document some of the basic tenets of a typical Finite Element Analysis (FEA) model, as well as, to educate new designers (and in some cases even experienced designers) on the basic information and best practices that should be captured and provided to technical reviewers of the results of FEA data.
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