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IPC 7092A PDF
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Design and Assembly Process Implementation for Embedded Circuitry
| Published by | Publication Date | Number of Pages |
| IPC | 10/01/2022 | 124 |
IPC 7092 – Revision A – Design and Assembly Process Implementation for Embedded Circuitry
IPC 7092 describes the design, materials and assembly challenges associated with implementing embedded circuitry into a printed board. It covers various aspects of embedded circuitry related with the design, selection, processing and testing to achieve a completed multilayered structure that is ready for surface mount and/or through-hole component attachment.
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