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IPC 4555 PDF
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Performance Specification for High Temperature Organic Solderability Preservatives (OSP) for Printed Boards
| Published by | Publication Date | Number of Pages |
| IPC | 04/01/2022 | 24 |
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IPC 4555 – Performance Specification for High Temperature Organic Solderability Preservatives (OSP) for Printed Boards
This performance specification sets requirements for High Temperature Organic Solderability Preservatives (OSP-High Temperature) for Pb-free soldering. It is intended for use by chemical suppliers, printed board manufacturers, electronics manufacturing services (EMS) and original equipment manufacturers (OEM).
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