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IPC 3408 PDF
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General Requirements for Anisotropically Conductive Adhesives Films
| Published by | Publication Date | Number of Pages |
| IPC | 11/01/1996 | 32 |
IPC 3408 – General Requirements for Anisotropically Conductive Adhesives Films
This document covers requirements and test methods for anisotropically conductive adhesive films used to bond and electrically connect components and for their long-term properties as a part of the printed wiring board assembly. Applications include the following: flexible PWB-to-glass, flexible PWB-to-rigid PWB, flip chip-to-glass, flip chip-to-flexible PWB, flip chip-to-rigid PWB, and fine pitch SMD. The adhesive film may be supplied pre-attached to a flexible circuit or other product.
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