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IEC 60191-4 Ed. 2.2 b PDF
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Mechanical standardization of semiconductor devices – Part 4: Coding system and classification into forms of package outlines for semiconductor device packages CONSOLIDATED EDITION
| Published by | Publication Date | Number of Pages |
| IEC | 10/22/2002 | 43 |
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IEC 60191-4 Ed. 2.2 b – Mechanical standardization of semiconductor devices – Part 4:Coding system and classification into forms of package outlines for semiconductor device packagesCONSOLIDATED EDITION
Describes a method for the designation and the classification into forms of package outlines for semiconductor devices. Provides a systematic method for generating universal descriptive designators for semiconductor packages.
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