IEC 62878-2-602 Ed. 1.0 b PDF
IEC 62878-2-602 Ed. 1.0 b PDF
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IEC 62878-2-602 Ed. 1.0 b PDF

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Device embedding assembly technology – Part 2-602: Guideline for stacked electronic module – Evaluation method of inter-module electrical connectivity

Published byPublication DateNumber of Pages
IEC06/01/202128
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IEC 62878-2-602 Ed. 1.0 b – Device embedding assembly technology – Part 2-602: Guideline for stacked electronic module – Evaluation method of inter-module electrical connectivity

This part of IEC 62878 specifies the requirements and evaluation methods of electrical connectivity. It is applicable to stacked electronic modules.

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