IEC 60749-40 Ed. 1.0 b PDF

Semiconductor devices – Mechanical and climatic test methods – Part 40: Board level drop test method using a strain gauge

IEC 60749-40 Ed. 1.0 b – Semiconductor devices – Mechanical and climatic test methods – Part 40: Board level drop test method using a strain gauge

IEC 60749-40:2011 is intended to evaluate and compare drop performance of a surface mount semiconductor device for handheld electronic product applications in an accelerated test environment, where excessive flexure of a circuit board causes product failure. The purpose is to standardize test methodology to provide a reproducible assessment of the drop test performance of a surface mounted semiconductor devices while duplicating the failure modes normally observed during product level test. This international standard uses a strain gauge to measure the strain and strain rate of a board in the vicinity of a component.