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IEC 60749-37 Ed. 1.0 b PDF
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Semiconductor devices – Mechanical and climatic test methods – Part 37: Board level drop test method using an accelerometer
| Published by | Publication Date | Number of Pages |
| IEC | 01/30/2008 | 39 |
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IEC 60749-37 Ed. 1.0 b – Semiconductor devices – Mechanical and climatic test methods – Part 37: Board level drop test method using an accelerometer
Provides a test method that is intended to evaluate and compare drop performance of surface mount electronic components for handheld electronic product applications in an accelerated test environment, where excessive flexure of a circuit board causes product failure. The purpose is to standardize the test board and test methodology to provide a reproducible assessment of the drop test performance of surface-mounted components while producing the same failure modes normally observed during product level test.
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