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IEC 60749-16 Ed. 1.0 b PDF
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Semiconductor devices – Mechanical and climatic test methods – Part 16: Particle impact noise detection (PIND)
| Published by | Publication Date | Number of Pages |
| IEC | 01/17/2003 | 13 |
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IEC 60749-16 Ed. 1.0 b – Semiconductor devices – Mechanical and climatic test methods – Part 16: Particle impact noise detection (PIND)
Defines a test aiming at detecting the presence of loose particles inside a cavity device such as, for example, chips of ceramic, pieces of bonding wire or solder balls (prills).
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