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IEC 60749-14 Ed. 1.0 b PDF
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Semiconductor devices – Mechanical and climatic test methods – Part 14: Robustness of terminations (lead integrity)
| Published by | Publication Date | Number of Pages |
| IEC | 08/07/2003 | 27 |
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IEC 60749-14 Ed. 1.0 b – Semiconductor devices – Mechanical and climatic test methods – Part 14: Robustness of terminations (lead integrity)
Provides various tests for determining the integrity between the lead/package interface and the lead itself when the lead(s) are bent due to faulty board assembly followed by rework of the part for re-assembly. Applicable to all through-hole devices and surface-mount devices requiring lead forming by the user.
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