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IEC 60512-6-2 Ed. 1.0 b PDF
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Connectors for electronic equipment – Tests and measurements – Part 6-2: Dynamic stress tests – Test 6b: Bump
| Published by | Publication Date | Number of Pages |
| IEC | 02/21/2002 | 9 |
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IEC 60512-6-2 Ed. 1.0 b – Connectors for electronic equipment – Tests and measurements – Part 6-2: Dynamic stress tests – Test 6b: Bump
Defines a standard test method to assess the ability of components (essentially connectors) to withstand specified severities of bump.
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