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IEC 60191-6-4 Ed. 1.0 b PDF
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Mechanical standardization of semiconductor devices – Part 6-4: General rules for the preparation of outline drawings of surface mounted semiconductor device packages – Measuring methods for package dimensions of ball grid array (BGA)
| Published by | Publication Date | Number of Pages |
| IEC | 06/11/2003 | 32 |
IEC 60191-6-4 Ed. 1.0 b – Mechanical standardization of semiconductor devices – Part 6-4: General rules for the preparation of outline drawings of surface mounted semiconductor device packages – Measuring methods for package dimensions of ball grid array (BGA)
IEC 60191-6-4:2003 covers the requirements for the measuring methods of ball grid array (BGA) dimensions.
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