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IEC 60191-6-3 Ed. 1.0 b PDF
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Mechanical standardization of semiconductor devices – Part 6-3: General rules for the preparation of outline drawings of surface mounted semiconductor device packages – Measuring methods for package dimensions of quad flat packs (QFP)
| Published by | Publication Date | Number of Pages |
| IEC | 09/29/2000 | 34 |
IEC 60191-6-3 Ed. 1.0 b – Mechanical standardization of semiconductor devices – Part 6-3: General rules for the preparation of outline drawings of surface mounted semiconductor device packages – Measuring methods for package dimensions of quad flat packs (QFP)
IEC 60191-6-3:2000 stipulates a method for quad flat packs (QFP) measuring dimensions which are classified into Form E.
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