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IEC 60191-6-2 Ed. 1.0 en PDF
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Mechanical standardization of semiconductor devices – Part 6-2: General rules for the preparation of outline drawings of surface mounted semiconductor devices packages – Design guide for 1,50 mm, 1,27 mm and 1,00 mm pitch ball and column terminal packages
| Published by | Publication Date | Number of Pages |
| IEC | 12/11/2001 | 10 |
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IEC 60191-6-2 Ed. 1.0 en – Mechanical standardization of semiconductor devices – Part 6-2: General rules for the preparation of outline drawings of surface mounted semiconductor devices packages – Design guide for 1,50 mm, 1,27 mm and 1,00 mm pitch ball and column terminal packages
Covers the requirements for the preparation of drawings of integrated circuit outlines for the various ball and column terminal packages.
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