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IEC 60191-5 Ed. 2.0 b PDF
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Mechanical standardization of semiconductor devices – Part 5: Recommendations applying to integrated circuit packages using tape automated bonding (TAB)
| Published by | Publication Date | Number of Pages |
| IEC | 04/23/1997 | 71 |
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IEC 60191-5 Ed. 2.0 b – Mechanical standardization of semiconductor devices – Part 5: Recommendations applying to integrated circuit packages using tape automated bonding (TAB)
Gives recommendations applying to integrated circuits supplied in packages using tape automated bonding (TAB) as the principal component for structural and interconnection functions. Covers the requirements for tape with bonded integrated circuits (IC) as supplied by a manufacturer to a user.
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