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BS PD IEC TR 63378-1 PDF
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Thermal standardization on semiconductor packages
| Published by | Publication Date | Number of Pages |
| BSI | 01/11/2022 | 24 |
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BS PD IEC TR 63378-1 – Thermal standardization on semiconductor packages
This part of IEC 63378 specifies the terms and definitions that are commonly used for thermal characteristics of BGA and QFP type semiconductor packages, and guidelines to use these thermal characteristics.
All current amendments available at time of purchase are included with the purchase of this document.
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