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ASTM F459 PDF
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Standard Test Methods for Measuring Pull Strength of Microelectronic Wire Bonds
| Published by | Publication Date | Number of Pages |
| ASTM | 03/01/2018 | 5 |
ASTM F459 – Standard Test Methods forMeasuring Pull Strength of Microelectronic Wire Bonds
1.1 These test methods cover tests to determine the pull strength of a series of wire bonds. Instructions are provided to modify the methods for use as a referee method. The methods can be used for wire bonds made with wire having a diameter of from 0.0007 to 0.003 in. (18 to 76 μm).
Note 1: Common usage at the present time considers the term “wire bond” to include the entire interconnection: both welds and the intervening wire span.
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