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ASTM F3192 PDF
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Standard Specification for High-Purity Copper Sputtering Target Used for Through-Silicon Vias (TSV) Mettalization
| Published by | Publication Date | Number of Pages |
| ASTM | 09/01/2016 | 5 |
ASTM F3192 – Standard Specification for High-Purity Copper Sputtering Target Used for Through-SiliconVias (TSV) Mettalization
1.1 This specification details the generic criteria requirements of high pure copper sputtering targets used as thin film material for through-silicon vias (TSV) metallization in advanced packaging.
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