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ASTM F3166 PDF
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Standard Specification for High-Purity Titanium Sputtering Target Used for Through-Silicon Vias (TSV) Metallization
| Published by | Publication Date | Number of Pages |
| ASTM | 05/01/2016 | 5 |
ASTM F3166 – Standard Specification for High-Purity Titanium Sputtering Target Used for Through-SiliconVias (TSV) Metallization
1.1 This specification details the generic criteria requirements of high pure titanium sputtering targets used as thin film material for through-silicon vias (TSV) metallization in advance packaging.
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