Your shopping cart is empty!
JEDEC JESD59 PDF
Product Code:
Availability:
Availability:
product
In Stock
In Stock
$30.80
$56.00
IN TAX $30.80
IN TAX $30.80
BOND WIRE MODELING STANDARD
| Published by | Publication Date | Number of Pages |
| JEDEC | 06/01/1997 | 16 |
JEDEC JESD59 – BOND WIRE MODELING STANDARD
This standard describes the modeling of a bond wire from an integrated circuit (IC) die to a package lead in a ball or wedge type wire bond configuration.
Reviews (0)