JEDEC JESD22-B116B PDF
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WIRE BOND SHEAR TEST
Published by | Publication Date | Number of Pages |
JEDEC | 04/01/2017 | 32 |
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JEDEC JESD22-B116B – WIRE BOND SHEAR TEST
This test provides a means for determining the strength of a gold ball bond to a die bonding surface or an aluminum wedge or stitch bond to a die or package bonding surface, and may be performed on pre-encapsulation or post-encapsulation parts.The wire bond shear test is destructive.It is appropriate for use in process development, process control and/or quality assurance.
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