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JEDEC JESD22-B109B PDF
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FLIP CHIP TENSILE PULL
| Published by | Publication Date | Number of Pages |
| JEDEC | 07/01/2014 | 16 |
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JEDEC JESD22-B109B – FLIP CHIP TENSILE PULL
The Flip Chip Tensile Pull Test Method is performed to determine the fracture mode and strength of the solder bump interconnection between the flip chip die and the substrate.It should be used to assess the consistency of the chip join process.This test method is a destructive test.
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