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JEDEC JESD 22-A121A (R2014) PDF
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MEASURING WHISKER GROWTH ON TIN AND TIN ALLOY SURFACE FINISHES
| Published by | Publication Date | Number of Pages |
| JEDEC | 07/01/2008 | 31 |
JEDEC JESD 22-A121A (R2014) – MEASURING WHISKER GROWTH ON TIN AND TIN ALLOY SURFACE FINISHES
The predominant terminal finishes on electronic components have been Sn-Pb alloys. As the industry moves toward Pb-free components and assembly processes, the predominant terminal finish materials will be pure Sn and alloys of Sn, including Sn-Bi and Sn-Ag. Pure Sn and Sn-based alloy electrodeposits and solder-dipped finishes may grow tin whiskers, which could electrically short across component terminals or break off the component and degrade the performance of electrical or mechanical parts.
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