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JEDEC JEP167A PDF
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Characterization of Interfacial Adhesion in Semiconductor Packages
| Published by | Publication Date | Number of Pages |
| JEDEC | 11/01/2020 | 32 |
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JEDEC JEP167A – Characterization of Interfacial Adhesion in Semiconductor Packages
This document identifies methods used for the characterization of die adhesion. It gives guidance which method to apply in which phase of the product or technology life cycle.
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