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JEDEC JEP156A PDF
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CHIP-PACKAGE INTERACTION UNDERSTANDING, IDENTIFICATION AND EVALUATION
| Published by | Publication Date | Number of Pages |
| JEDEC | 03/01/2018 | 24 |
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JEDEC JEP156A – CHIP-PACKAGE INTERACTION UNDERSTANDING, IDENTIFICATION AND EVALUATION
This publication references a set of frequently recommended and accepted JEDEC reliability stress tests. These tests are used for qualifying new and modified technology/ process/ product families, as well as individual solid state surface-mount products.
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