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IPC WP-006 PDF
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Round Robin Testing & Analysis: Lead-Free Alloys Tin, Silver, & Copper
| Published by | Publication Date | Number of Pages |
| IPC | 07/01/2003 | 25 |
IPC WP-006 – Round Robin Testing & Analysis: Lead-Free Alloys Tin, Silver, & Copper
The IPC Solder Products Value Council White Paper, “Round Robin Testing and Analysis, Lead Free Alloys – Tin, Silver and Cooper” (IPC-SPVC-WP-006), summarizes a round robin test program on the assembly properties of three lead free solder alloys. Melt characterization, wetting balance responses and solder spread tests were performed by IPC-SPVC members on the three tin-silver-cooper alloys in the following percentages respectively: 96.5/ 3.0/ 0.5; 95.5/ 3.8/ 0.7; and 95.5/ 4.0/ 0.5. The 19-page white paper includes examples of statistical analysis, data analysis of the tests, data tables of testing participants and a reproduction of IPC test methods used. Released August 2003.considerations, consumables, waste streams and overall operating costs.
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