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IPC TR-579 PDF
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Round Robin Reliability Evaluation of Small Diameter Plated Through Holes in PWBs
| Published by | Publication Date | Number of Pages |
| IPC | 09/01/1988 | 80 |
IPC TR-579 – Round Robin Reliability Evaluation of Small Diameter Plated Through Holes in PWBs
Approximately 200,000 plated through-holes, covering primarily electroplated but also electroless technology, were exposed to several different thermal cycles. A number of PTH diameters, board constructions and plating thicknesses were evaluated.
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