Your shopping cart is empty!
IPC J-STD-033D PDF
Product Code:
Availability:
Availability:
product
In Stock
In Stock
$51.15
$93.00
IN TAX $51.15
IN TAX $51.15
Handling, Packing, Shipping and Use of Moisture, Reflow, and Process Sensitive Devices
| Published by | Publication Date | Number of Pages |
| IPC | 03/01/2018 | 32 |
Preview
IPC J-STD-033D – Handling, Packing, Shipping and Use of Moisture, Reflow, and Process Sensitive Devices
IPC/JEDEC J-STD-033D provides surface mount device manufacturers and users with standardized methods for handling, packing, shipping and use of moisture/reflow sensitive components. These methods help avoid damage from moisture absorption and exposure to solder reflow temperatures that can result in yield and reliability degradation and damaged components. IPC/JEDEC J-STD-033D procedures provide a minimum shelf life of 12 months from the seal date when properly implemented. Developed by IPC and JEDEC.
Worldwide Standards PDF © 2024
Reviews (0)