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IPC J-STD-027 PDF
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Mechanical Outline Standard for Flip Chip or Chip Scale Configurations
| Published by | Publication Date | Number of Pages |
| IPC | 02/01/2003 | 20 |
IPC J-STD-027 – Mechanical Outline Standard for Flip Chip or Chip Scale Configurations
THis standard establishes mechanical outline requirements for devices supplied in flip chip or CHip Size Package (CSP) formats. including die surface, die terminals, and interconnection balls/bumps/lands to the next level.
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