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IPC 9701B PDF
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Thermal Cycling Test Method for Fatigue Life Characterization of Surface Mount Attachments
| Published by | Publication Date | Number of Pages |
| IPC | 02/01/2022 | 24 |
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IPC 9701B – Thermal Cycling Test Method for Fatigue Life Characterization of Surface Mount Attachments
This specification establishes a thermal cycling test method to characterize the fatigue lifetimes of surface mount solder attachments of electronic assemblies. The surface mount devices may be solder-attached to rigid, flexible or rigid-flex printed boards. The characterization results can be used to predict field lifetime of solder attachments for the use environments and conditions of electronic assemblies.
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