Your shopping cart is empty!
IPC 7094A PDF
Product Code:
Availability:
Availability:
product
In Stock
In Stock
$92.40
$168.00
IN TAX $92.40
IN TAX $92.40
Design and Assembly Process Implementation for Flip Chip and Die-Size Components
| Published by | Publication Date | Number of Pages |
| IPC | 01/01/2018 | 96 |
Preview
IPC 7094A – Design and Assembly Process Implementation for Flip Chip and Die-Size Components
IPC 7094A describes the design and assembly challenges for implementing flip chip technology in a direct chip attach(DCA) assembly. The effect of bare-die or die-size components in a flip chip format has an impact on component characteristicsand dictates the appropriate assembly methodology. This standard focuses on design, assembly methodology, criticalinspection, repair and reliability issues associated with flip chip and die-size package technologies, including wafer-levelball grid array (WLBGA).
Worldwide Standards PDF © 2024
Reviews (0)