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IPC 6801 PDF
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Terms & Definitions, Test Methods, and Design Examples for Buld-Up/High Density Interconnect (HDI) Printed Wiring Boards
| Published by | Publication Date | Number of Pages |
| IPC | 01/01/2000 | 41 |
IPC 6801 – Terms & Definitions, Test Methods, and Design Examples for Buld-Up/High Density Interconnect (HDI) Printed Wiring Boards
Recognizing Japan’s leadership in microvia substrate production, the IPC HDI Committee chose to adopt JPCA-BU01 as IPC/JPCA-6801. The adoption of this document is a part of the ongoing efforts of the IPC HDI Committee and JPCA Build-Up PWB Committee to ensure global consistency in the terminology, requirements and test methods for HDI and microvia applications. IPC/JPCA-6801 lists terms specific to HDI and test methods for CTE for materials and HDI PWBs, peel strength and thermal shock. Also included is a design criteria table and background information for the development of a standard for HDI PWBs.
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