Your shopping cart is empty!
IPC 2225 PDF
Product Code:
Availability:
Availability:
product
In Stock
In Stock
$72.05
$131.00
IN TAX $72.05
IN TAX $72.05
Sectional Design Standard for Organic Multichip Modules (MCML & MCM-L Assemblies)
| Published by | Publication Date | Number of Pages |
| IPC | 05/01/1998 | 44 |
IPC 2225 – Sectional Design Standard for Organic Multichip Modules (MCML & MCM-L Assemblies)
This standard establishes the requirements and other considerations (thermal, electrical, electromechanical and mechanical) for the design of Single Chip Module (SCM-L), MCM or MCM-L assemblies. Key concepts include adhesive interconnection information, typical die attach materials, microvia material properties, relationships with DFM and DFE.
Reviews (0)