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IEC 62047-10 Ed. 1.0 b PDF
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Semiconductor devices – Micro-electromechanical devices – Part 10: Micro-pillar compression test for MEMS materials
| Published by | Publication Date | Number of Pages |
| IEC | 07/26/2011 | 22 |
IEC 62047-10 Ed. 1.0 b – Semiconductor devices – Micro-electromechanical devices – Part 10: Micro-pillar compression test for MEMS materials
IEC 62047-10:2011 specifies micro-pillar compression test method to measure compressive properties of MEMS materials with high accuracy, repeatability, and moderate effort of specimen fabrication. The uniaxial compressive stress-strain relationship of a specimen is measured, and the compressive modulus of elasticity and yield strength can be obtained. This standard is applicable to metallic, ceramic, and polymeric materials.
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