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IEC 62137-1-1 Ed. 1.0 b PDF
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Surface mounting technology – Environmental and endurance test methods for surface mount solder joint – Part 1-1: Pull strength test
| Published by | Publication Date | Number of Pages |
| IEC | 05/14/2008 | 30 |
IEC 62137-1-1 Ed. 1.0 b – Surface mounting technology – Environmental and endurance test methods for surface mount solder joint – Part 1-1: Pull strength test
The test method described in IEC 62137-1-1:2007 is applicable to gull-wing lead surface mounting components. The method is designed to test and evaluate the endurance of the solder joint between component leads and lands on a substrate, by means of a pull type mechanical stress. This test is suitable for evaluating the effects of repeated temperature change on the strength of the solder joint between component terminals and lands on a substrate.
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