IEC 62047-8 Ed. 1.0 b PDF

Semiconductor devices – Micro-electromechanical devices – Part 8: Strip bending test method for tensile property measurement of thin films

IEC 62047-8 Ed. 1.0 b – Semiconductor devices – Micro-electromechanical devices – Part 8: Strip bending test method for tensile property measurement of thin films

IEC 62047-8:2011 specifies the strip bending test method to measure tensile properties of thin films with high accuracy, repeatability, moderate effort of alignment and handling compared to the conventional tensile test. This testing method is valid for test pieces with a thickness between 50 nm and several mum, and with an aspect ratio (ratio of length to thickness) of more than 300. The hanging strip (or bridge) between two fixed supports are widely adopted in MEMS or micro-machines. It is much easier to fabricate these strips than the conventional tensile test pieces. The test procedures are so simple to be readily automated. This international standard can be utilized as a quality control test for MEMS production since its testing throughput is very high compared to the conventional tensile test.