IEC 62047-26 Ed. 1.0 b PDF

IEC 62047-26 Ed. 1.0 b – Semiconductor devices – Micro-electromechanical devices – Part 26: Description and measurement methods for micro trench and needle structures

IEC 62047-26:2016 specifies descriptions of trench structure and needle structure in a micrometer scale. In addition, it provides examples of measurement for the geometry of both structures. For trench structures, this standard applies to structures with a depth of 1 µm to 100 µm; walls and trenches with respective widths of 5 µm to 150 µm; and aspect ratio of 0,006 7 to 20. For needle structures, the standard applies to structures with three or four faces with a height, horizontal width and vertical width of 2 µm or larger, and with dimensions that fit inside a cube with sides of 100 µm.This standard is applicable to the structural design of MEMS and geometrical evaluation after MEMS processes.