IEC 62047-17 Ed. 1.0 b PDF

Semiconductor devices – Micro-electromechanical devices – Part 17: Bulge test method for measuring mechanical properties of thin films

IEC 62047-17 Ed. 1.0 b – Semiconductor devices – Micro-electromechanical devices – Part 17: Bulge test method for measuring mechanical properties of thin films

IEC 62047-17:2015 specifies the method for performing bulge tests on the free-standing film that is bulged within a window. The specimen is fabricated with micro/nano structural film materials, including metal, ceramic and polymer films, for MEMS, micromachines and others. The thickness of the film is in the range of 0,1 μ to 10 μ, and the width of the rectangular and square membrane window and the diameter of the circular membrane range from 0,5 mm to 4 mm. The tests are carried out at ambient temperature, by applying a uniformly-distributed pressure to the testing film specimen with bulging window. Elastic modulus and residual stress for the film materials can be determined with this method.