IEC 60749-22 Ed. 1.0 b PDF
IEC 60749-22 Ed. 1.0 b PDF
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IEC 60749-22 Ed. 1.0 b PDF

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Semiconductor devices – Mechanical and climatic test methods – Part 22: Bond strength

Published byPublication DateNumber of Pages
IEC09/12/200241
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IEC 60749-22 Ed. 1.0 b – Semiconductor devices – Mechanical and climatic test methods – Part 22: Bond strength

Applicable to semiconductor devices (discrete devices and integrated circuits), this test measures bond strength or determine compliance with specified bond strength requirements

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