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IEC 60749-22 Ed. 1.0 b PDF
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Semiconductor devices – Mechanical and climatic test methods – Part 22: Bond strength
| Published by | Publication Date | Number of Pages |
| IEC | 09/12/2002 | 41 |
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IEC 60749-22 Ed. 1.0 b – Semiconductor devices – Mechanical and climatic test methods – Part 22: Bond strength
Applicable to semiconductor devices (discrete devices and integrated circuits), this test measures bond strength or determine compliance with specified bond strength requirements
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