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IEC 60749-20 Ed. 3.0 b PDF
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Semiconductor devices – Mechanical and climatic test methods – Part 20: Resistance of plastic encapsulated SMDs to the combined effect of moisture and soldering heat
| Published by | Publication Date | Number of Pages |
| IEC | 08/01/2020 | 60 |
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IEC 60749-20 Ed. 3.0 b – Semiconductor devices – Mechanical and climatic test methods – Part 20: Resistance of plastic encapsulated SMDs to the combined effect of moisture and soldering heat
This part of IEC 60749 provides a means of assessing the resistance to soldering heat of semiconductors packaged as plastic encapsulated surface mount devices (SMDs). This test is destructive.
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