Your shopping cart is empty!
IEC 60749-15 Ed. 3.0 b PDF
Product Code:
Availability:
Availability:
product
In Stock
In Stock
$28.05
$51.00
IN TAX $28.05
IN TAX $28.05
Semiconductor devices – Mechanical and climatic test methods – Part 15: Resistance to soldering temperature for through-hole mounted devices
| Published by | Publication Date | Number of Pages |
| IEC | 07/14/2020 | 17 |
Preview
IEC 60749-15 Ed. 3.0 b – Semiconductor devices – Mechanical and climatic test methods – Part 15: Resistance to soldering temperature for through-hole mounted devices
IEC 60749-15:2020 describes a test used to determine whether encapsulated solid state devices used for through-hole mounting can withstand the effects of the temperature to which they are subjected during soldering of their leads by using wave soldering or a soldering iron.
Worldwide Standards PDF © 2024
Reviews (0)