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IEC 60191-6-21 Ed. 1.0 b PDF
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Mechanical standardization of semiconductor devices – Part 6-21: General rules for the preparation of outline drawings of surface mounted semiconductor device packages – Measuring methods for package dimensions of small outline packages (SOP)
| Published by | Publication Date | Number of Pages |
| IEC | 08/30/2010 | 28 |
IEC 60191-6-21 Ed. 1.0 b – Mechanical standardization of semiconductor devices – Part 6-21: General rules for the preparation of outline drawings of surface mounted semiconductor device packages – Measuring methods for package dimensions of small outline packages (SOP)
IEC 60191-6-21:2010 specifies methods to measure package dimensions of small outline packages (SOP), package outline form E in accordance to IEC 60191-4.
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