IEC 60191-6-2 Ed. 1.0 b PDF

Mechanical standardization of semiconductor devices – Part 6-2: General rules for the preparation of outline drawings of surface mounted semiconductor devices packages – Design guide for 1,50 mm, 1,27 mm and 1,00 mm pitch ball and column terminal packages

IEC 60191-6-2 Ed. 1.0 b – Mechanical standardization of semiconductor devices – Part 6-2: General rules for the preparation of outline drawings of surface mounted semiconductor devices packages – Design guide for 1,50 mm, 1,27 mm and 1,00 mm pitch ball and column terminal packages

IEC 60191-6-2:2001 covers the requirements for the preparation of drawings of integrated circuit outlines for the various ball terminal packages, e.g. ceramic ball grid array (C-BGA), plastic ball grid array (P-BGA), tape ball grid array (T-BGA) and others as well as column terminal packages, e.g. ceramic column grid array (C-CGA).