IEC 60191-6-12 Ed. 2.0 b PDF

Mechanical standardization of semiconductor devices – Part 6-12: General rules for the preparation of outline drawings of surface mounted semiconductor device packages – Design guidelines for fine-pitch land grid array (FLGA)

IEC 60191-6-12 Ed. 2.0 b – Mechanical standardization of semiconductor devices – Part 6-12: General rules for the preparation of outline drawings of surface mounted semiconductor device packages – Design guidelines for fine-pitch land grid array (FLGA)

IEC 60191-6-12:2011 provides standard outline drawings, dimensions, and recommended variations for all fine-pitch land grid array packages (FLGA) with terminal pitch of 0,8 mm or less. This edition includes the following significant changes with respect to the previous edition:
– scope is expanded so that this standard include the square type FLGA. The title of this standard has been changed accordingly: “Rectangular type” has been deleted from the title;
– ball pitch of 0,3 mm has been added;
– datum is changed from the body datum to the ball datum;
– combination lists of D, E, MD, and ME have been revised.